DEVICE PACKAGING. INTERNATIONAL CONFERENCE AND EXHIBITION. 1ST 2005.

Item #: 00196

Our Price:

$218.00

Title:	1st International Conference and Exhibition on Device Packaging 2005: Everything in Electronics Between the Chip and the System
Desc:	Proceedings of a meeting held 13-16 March 2005, Scottsdale, Arizona, USA.
Sponsor:	International Microelectronics and Packaging Society ( IMAPS )
ISBN:	9781604235722
Pages:	361 (1 Vol)
Format:	Softcover
Publisher:	Curran Associates, Inc. ( Aug 2006 )