CERAMIC INTERCONNECT AND CERAMIC MICROSYSTEMS TECHNOLOGIES. IMAPS/ACerS INTERNATIONAL CONFERENCE AND EXHIBITION. 2ND 2006.

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International Microelectronics and Packaging Society ( IMAPS )

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CERAMIC INTERCONNECT AND CERAMIC MICROSYSTEMS TECHNOLOGIES. IMAPS/ACerS INTERNATIONAL CONFERENCE AND EXHIBITION. 2ND 2006.

CERAMIC INTERCONNECT AND CERAMIC MICROSYSTEMS TECHNOLOGIES. IMAPS/ACerS INTERNATIONAL CONFERENCE AND EXHIBITION. 2ND 2006.

CERAMIC INTERCONNECT AND CERAMIC MICROSYSTEMS TECHNOLOGIES. IMAPS/ACerS INTERNATIONAL CONFERENCE AND EXHIBITION. 2ND 2006.

Item #: 00318

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Product Description

Title:	2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT2006)
Desc:	Proceedings of a meeting held 24-27 April 2006, Denver, Colorado, USA.
Sponsor:	International Microelectronics and Packaging Society ( IMAPS )
ISBN:	9781604236200
Pages:	504 (1 Vol)
Format:	Softcover
Publisher:	Curran Associates, Inc. ( Apr 2007 )

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