Details
- Title: 2006 International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Micro Systems
- Date/Location: Held 23-26 April 2006, Como, Italy.
- IEEE #: CFP06566-POD
- ISBN: 9781424402755
- Pages: 757 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2007 )
Description
Members/Attendees
Tab 4
- Title: 2006 International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Micro Systems
- Date/Location: Held 23-26 April 2006, Como, Italy.
- IEEE #: CFP06566-POD
- ISBN: 9781424402755
- Pages: 757 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2007 )