THERMAL AND MECHANICAL SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 2006. (2 VOLS)

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000571
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  • Title: 2006 International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Micro Systems
  • Date/Location: Held 23-26 April 2006, Como, Italy.
  • IEEE #: CFP06566-POD
  • ISBN: 9781424402755
  • Pages: 757 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Mar 2007 )

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  • Title: 2006 International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Micro Systems
  • Date/Location: Held 23-26 April 2006, Como, Italy.
  • IEEE #: CFP06566-POD
  • ISBN: 9781424402755
  • Pages: 757 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Mar 2007 )