Details
- Title: 2006 13th International Symposium on Physical & Failure Analysis of ICs
- Date/Location: Held 3-7 July 2006, Singapore.
- IEEE #: CFP06777-POD
- ISBN: 9781424402052
- Pages: 355 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2007 )
Description
Members/Attendees
Tab 4
- Title: 2006 13th International Symposium on Physical & Failure Analysis of ICs
- Date/Location: Held 3-7 July 2006, Singapore.
- IEEE #: CFP06777-POD
- ISBN: 9781424402052
- Pages: 355 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2007 )