Details
- Title: 2006 7th International Conference on Electronics Packaging Technology
- Date/Location: Held 26-29 August 2006, Shanghai, China.
- IEEE #: CFP06553-POD
- ISBN: 9781424406197
- Pages: 872 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2007 )
Description
Members/Attendees
Tab 4
- Title: 2006 7th International Conference on Electronics Packaging Technology
- Date/Location: Held 26-29 August 2006, Shanghai, China.
- IEEE #: CFP06553-POD
- ISBN: 9781424406197
- Pages: 872 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2007 )