Details
- Title: 2006 International Microsystems, Packaging, Assembly Conference Taiwan
- Date/Location: Held 18-20 October 2006, Taipei, Taiwan.
- IEEE #: CFP0659B-POD
- ISBN: 9781424407347
- Pages: 209 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2007 )
Description
Members/Attendees
Tab 4
- Title: 2006 International Microsystems, Packaging, Assembly Conference Taiwan
- Date/Location: Held 18-20 October 2006, Taipei, Taiwan.
- IEEE #: CFP0659B-POD
- ISBN: 9781424407347
- Pages: 209 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2007 )