THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICRO SYSTEM. INTERNATIONAL CONFERENCE. 2007. (2 VOLS)

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Title:	2007 International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics & Micro System
Desc:	Proceedings of a meeting held 15-18 April 2007, London, United Kingdom.
Sponsor:	Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:	CFP07566-PRT
ISBN:	9781424411054
Pages:	750 (2 Vols)
Format:	Softcover
Publisher:	Institute of Electrical and Electronics Engineers ( IEEE )
Notes:	Authorized distributor of all IEEE proceedings
TOC:	View Table of Contents