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THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICRO SYSTEM. INTERNATIONAL CONFERENCE. 2007. (2 VOLS)

THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICRO SYSTEM. INTERNATIONAL CONFERENCE. 2007. (2 VOLS)

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THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICRO SYSTEM. INTERNATIONAL CONFERENCE. 2007. (2 VOLS)
Item #: 01423
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Product Description
Title:2007 International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics & Micro System
Desc:Proceedings of a meeting held 15-18 April 2007, London, United Kingdom.
Prod#:CFP07566-POD
ISBN:9781424411054
Pages:750 (2 Vols)
Format:Softcover
Notes: Authorized distributor of all IEEE proceedings
TOC:View Table of Contents
Publ:Institute of Electrical and Electronics Engineers ( IEEE )
POD Publ:Curran Associates, Inc. ( Jul 2007 )
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