Details
- Title: 2007 International Symposium on High Density Design Packaging and Microsystem Integration
- Date/Location: Held 26-28 June 2007, Shanghai, China.
- IEEE #: CFP07579-POD
- ISBN: 9781424412525
- Pages: 474 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2008 )
Description
Members/Attendees
Tab 4
- Title: 2007 International Symposium on High Density Design Packaging and Microsystem Integration
- Date/Location: Held 26-28 June 2007, Shanghai, China.
- IEEE #: CFP07579-POD
- ISBN: 9781424412525
- Pages: 474 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2008 )