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HIGH DENSITY DESIGN, PACKAGING AND MICROSYSTEM INTEGRATION. INTERNATIONAL SYMPOSIUM. 2007.

HIGH DENSITY DESIGN, PACKAGING AND MICROSYSTEM INTEGRATION. INTERNATIONAL SYMPOSIUM. 2007.

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HIGH DENSITY DESIGN, PACKAGING AND MICROSYSTEM INTEGRATION. INTERNATIONAL SYMPOSIUM. 2007.
Item #: 01827
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Product Description
Title:2007 International Symposium on High Density Design Packaging and Microsystem Integration
Desc:Proceedings of a meeting held 26-28 June 2007, Shanghai, China.
Sponsor:Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:CFP07579-POD
ISBN:9781424412525
Pages:474 (1 Vol)
Format:Softcover
Publisher:Institute of Electrical and Electronics Engineers ( IEEE )
Notes: Authorized distributor of all IEEE proceedings
TOC:View Table of Contents
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