Details
- Title: 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics
- Date/Location: Held 16-18 January 2007, Tokyo, Japan.
- IEEE #: CFP07516-POD
- ISBN: 9781424411306
- Pages: 310 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2007 )
Description
Members/Attendees
Tab 4
- Title: 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics
- Date/Location: Held 16-18 January 2007, Tokyo, Japan.
- IEEE #: CFP07516-POD
- ISBN: 9781424411306
- Pages: 310 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2007 )