Details
- Title: 2007 International Microsystems, Packaging, Assembly and Circuits Technology
- Date/Location: Held 1-3 October 2007, Taipei, Taiwan.
- IEEE #: CFP0759B-POD
- ISBN: 9781424416363
- Pages: 392 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2008 )
Description
Members/Attendees
Tab 4
- Title: 2007 International Microsystems, Packaging, Assembly and Circuits Technology
- Date/Location: Held 1-3 October 2007, Taipei, Taiwan.
- IEEE #: CFP0759B-POD
- ISBN: 9781424416363
- Pages: 392 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2008 )