Details
- Title: 2007 8th International Conference on Electronic Packaging Technology
- Date/Location: Held 14-17 August 2007, Shanghai, China.
- IEEE #: CFP07553-POD
- ISBN: 9781424413911
- Pages: 826 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2008 )
Description
Members/Attendees
Tab 4
- Title: 2007 8th International Conference on Electronic Packaging Technology
- Date/Location: Held 14-17 August 2007, Shanghai, China.
- IEEE #: CFP07553-POD
- ISBN: 9781424413911
- Pages: 826 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2008 )