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THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO- ELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 2008. (2 VOLS) EUROSIME 2008

THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO- ELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 2008. (2 VOLS) EUROSIME 2008

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THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO- ELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 2008. (2 VOLS) EUROSIME 2008
Item #: 03032
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Product Description
Title:2008 International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Desc:Proceedings of a meeting held 20-23 April 2008, Freiburg Im Breisgau, Germany.
Sponsor:Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:CFP08566-POD
ISBN:9781424421275
Pages:699 (2 Vols)
Format:Softcover
Publisher:Institute of Electrical and Electronics Engineers ( IEEE )
Notes: Authorized distributor of all IEEE proceedings
TOC:View Table of Contents
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