THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO- ELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 2008. (2 VOLS) EUROSIME 2008

Item #: 03032

Our Price:

$294.00

Pricing: IEEE Member # :

Title:	2008 International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Desc:	Proceedings of a meeting held 20-23 April 2008, Freiburg Im Breisgau, Germany.
Sponsor:	Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:	CFP08566-PRT
ISBN:	9781424421275
Pages:	699 (2 Vols)
Format:	Softcover
Publisher:	Institute of Electrical and Electronics Engineers ( IEEE )
Notes:	Authorized distributor of all IEEE proceedings
TOC:	View Table of Contents