Details
- Title: 2008 IEEE International Conference on Shape Modeling and Applications
- Date/Location: Held 4-6 June 2008, Stony Brook, New York.
- Editor: Spagnuolo, M.
- IEEE #: CFP08093-POD
- ISBN: 9781424422609
- Pages: 287 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2008 )
Description
Members/Attendees
Tab 4
- Title: 2008 IEEE International Conference on Shape Modeling and Applications
- Date/Location: Held 4-6 June 2008, Stony Brook, New York.
- Editor: Spagnuolo, M.
- IEEE #: CFP08093-POD
- ISBN: 9781424422609
- Pages: 287 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2008 )