Details
- Title: Conference Record of 2008 Annual Pulp and Paper Industry Technical Conference
- Date/Location: Held 22-27 June 2008, Seattle, Washington.
- IEEE #: CFP08PAP-POD
- ISBN: 9781424425242
- Pages: 245 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2008 )
Description
Members/Attendees
Tab 4
- Title: Conference Record of 2008 Annual Pulp and Paper Industry Technical Conference
- Date/Location: Held 22-27 June 2008, Seattle, Washington.
- IEEE #: CFP08PAP-POD
- ISBN: 9781424425242
- Pages: 245 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2008 )