Details
- Title: 2008 International Workshop on Metamaterials (Meta2008)
- Date/Location: Held 9-12 November 2008, Nanjing, China.
- Editor: Cui, T.J.
- IEEE #: CFP0873E-POD
- ISBN: 9781424426089
- Pages: 374 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2009 )
Description
Members/Attendees
Tab 4
- Title: 2008 International Workshop on Metamaterials (Meta2008)
- Date/Location: Held 9-12 November 2008, Nanjing, China.
- Editor: Cui, T.J.
- IEEE #: CFP0873E-POD
- ISBN: 9781424426089
- Pages: 374 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2009 )