Details
- Title: IEEE 9th VLSI Packaging Workshop in Japan (VPWJ 2008)
- Date/Location: Held 1-2 December 2008, Kyoto, Japan.
- IEEE #: CFP08PWJ-POD
- ISBN: 9781424434985
- Pages: 150 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2009 )
Description
Members/Attendees
Tab 4
- Title: IEEE 9th VLSI Packaging Workshop in Japan (VPWJ 2008)
- Date/Location: Held 1-2 December 2008, Kyoto, Japan.
- IEEE #: CFP08PWJ-POD
- ISBN: 9781424434985
- Pages: 150 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2009 )