MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE. INTERNATIONAL. 3RD 2008. (IMPACT 2008)

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Title:	2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT 2008)
Desc:	Proceedings of a meeting held 22-24 October 2008, Taipei, Taiwan.
Sponsor:	Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:	CFP0859B-PRT
ISBN:	9781424436231
Pages:	397 (1 Vol)
Format:	Softcover
Publisher:	Institute of Electrical and Electronics Engineers ( IEEE )
Notes:	Authorized distributor of all IEEE proceedings
TOC:	View Table of Contents