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MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE. INTERNATIONAL. 3RD 2008. (IMPACT 2008)

MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE. INTERNATIONAL. 3RD 2008. (IMPACT 2008)

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MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE. INTERNATIONAL. 3RD 2008. (IMPACT 2008)
Item #: 04697
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Product Description
Title:2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT 2008)
Desc:Proceedings of a meeting held 22-24 October 2008, Taipei, Taiwan.
Sponsor:Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:CFP0859B-POD
ISBN:9781424436231
Pages:397 (1 Vol)
Format:Softcover
Publisher:Institute of Electrical and Electronics Engineers ( IEEE )
Notes: Authorized distributor of all IEEE proceedings
TOC:View Table of Contents
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