Details
- Title: 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT 2008)
- Date/Location: Held 22-24 October 2008, Taipei, Taiwan.
- IEEE #: CFP0859B-POD
- ISBN: 9781424436231
- Pages: 397 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2009 )
Description
Members/Attendees
Tab 4
- Title: 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT 2008)
- Date/Location: Held 22-24 October 2008, Taipei, Taiwan.
- IEEE #: CFP0859B-POD
- ISBN: 9781424436231
- Pages: 397 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2009 )