Details
- Title: 2008 IEEE International Conference on Granular Computing
- Date/Location: Held 26-28 August 2008, Hangzhou, China.
- Editor: Lin, T.Y.
- IEEE #: CFP08GRC-POD
- ISBN: 9781424425129
- Pages: 872 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2009 )
Description
Members/Attendees
Tab 4
- Title: 2008 IEEE International Conference on Granular Computing
- Date/Location: Held 26-28 August 2008, Hangzhou, China.
- Editor: Lin, T.Y.
- IEEE #: CFP08GRC-POD
- ISBN: 9781424425129
- Pages: 872 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2009 )