Details
- Title: 2009 IEEE International Conference on Shape Modeling and Applications (SMI 2009)
- Date/Location: Held 26-28 June 2009, Beijing, China.
- IEEE #: CFP09093-POD
- ISBN: 9781424440696
- Pages: 208 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2009 )
Description
Members/Attendees
Tab 4
- Title: 2009 IEEE International Conference on Shape Modeling and Applications (SMI 2009)
- Date/Location: Held 26-28 June 2009, Beijing, China.
- IEEE #: CFP09093-POD
- ISBN: 9781424440696
- Pages: 208 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2009 )