COPPER INTERCONNECTS, NEW CONTACT METALLURGIES/STRUCTURES, AND LOW-K INTER-LEVEL DIELECTRICS. (AT 214TH ECS MEETING)

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005839
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  • Title: Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Inter-Level Dielectrics
  • Subtitle: Held at the 214th ECS Meeting
  • Date/Location: Held 12-17 October 2008, Honolulu, Hawaii.
  • Series: ECS Transactions Volume 16 No.19
  • Editor: Mathad, G.
  • ISBN: 9781615672936
  • Pages: 61 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Sep 2009 )

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  • Title: Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Inter-Level Dielectrics
  • Subtitle: Held at the 214th ECS Meeting
  • Date/Location: Held 12-17 October 2008, Honolulu, Hawaii.
  • Series: ECS Transactions Volume 16 No.19
  • Editor: Mathad, G.
  • ISBN: 9781615672936
  • Pages: 61 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Sep 2009 )