Conference Proceedings
Home
 > 
Browse by Publisher
 > 
Electrochemical Society ( ECS )
 > 
COPPER INTERCONNECTS, NEW CONTACT METALLURGIES/STRUCTURES, AND LOW-K INTER-LEVEL DIELECTRICS. (AT 214TH ECS MEETING)

COPPER INTERCONNECTS, NEW CONTACT METALLURGIES/STRUCTURES, AND LOW-K INTER-LEVEL DIELECTRICS. (AT 214TH ECS MEETING)

Send a Friend    
COPPER INTERCONNECTS, NEW CONTACT METALLURGIES/STRUCTURES, AND LOW-K INTER-LEVEL DIELECTRICS. (AT 214TH ECS MEETING)
Item #: 05839
Our Price:   
$63.00
Product Description
Title:Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Inter-Level Dielectrics
Desc:Proceedings of a meeting held 12-17 October 2008, Honolulu, Hawaii. Held at the 214th ECS Meeting
Series:ECS Transactions Volume 16 No.19
Sponsor:Electrochemical Society ( ECS )
Editor:Mathad, G.
ISBN:9781615672936
Pages:61 (1 Vol)
Format:Softcover
Publisher:Curran Associates, Inc. ( Sep 2009 )
Related Products
CORROSION PROTECTIVE COATINGS AND INHIBITORS. (AT 208TH ECS MEETING)
CORROSION PROTECTIVE COATINGS AND INHIBITORS. (AT 208TH ECS MEETING)
ATOMIC LAYER DEPOSITION. (AT 208TH ECS MEETING)
ATOMIC LAYER DEPOSITION. (AT 208TH ECS MEETING)
COPPER INTERCONNECTS, NEW CONTACT AND BARRIER METALLURGIES/STRUCTURES, AND LOW-K INTERLEVEL DIELECTRICS III. (AT 208TH ECS MEETING)
COPPER INTERCONNECTS, NEW CONTACT AND BARRIER METALLURGIES/STRUCTURES, AND LOW-K INTERLEVEL DIELECTRICS III. (AT 208TH ECS MEETING)
Browse By PublisherShop By Category
Partner With Us
Find Us On Facebook
Dave A Curran, EzineArticles.com Basic Author