Details
- Title: Electronics Packaging 3
- Subtitle: Held at the 214th ECS Meeting
- Date/Location: Held 12-17 October 2008, Honolulu, Hawaii.
- Series: ECS Transactions Volume 16 No.22
- Editor: Hayase, M.
- ISBN: 9781615672967
- Pages: 111 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Sep 2009 )
Description
Members/Attendees
Tab 4
- Title: Electronics Packaging 3
- Subtitle: Held at the 214th ECS Meeting
- Date/Location: Held 12-17 October 2008, Honolulu, Hawaii.
- Series: ECS Transactions Volume 16 No.22
- Editor: Hayase, M.
- ISBN: 9781615672967
- Pages: 111 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Sep 2009 )