Details
- Title: 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2009)
- Date/Location: Held 6-10 July 2009, Suzhou, Jiangsu, China.
- IEEE #: CFP09777-POD
- ISBN: 9781424439119
- Pages: 828 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2009 )
Description
Members/Attendees
Tab 4
- Title: 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2009)
- Date/Location: Held 6-10 July 2009, Suzhou, Jiangsu, China.
- IEEE #: CFP09777-POD
- ISBN: 9781424439119
- Pages: 828 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2009 )