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ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 2009. (ICEPT-HDP 2009) (2 VOLS)

ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 2009. (ICEPT-HDP 2009) (2 VOLS)

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ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 2009. (ICEPT-HDP 2009) (2 VOLS)
Item #: 06144
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Product Description
Title:2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009)
Desc:Proceedings of a meeting held 10-13 August 2009, Beijing, China.
Sponsor:Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:CFP09553-POD
ISBN:9781424446582
Pages:1,273 (2 Vols)
Format:Softcover
Publisher:Institute of Electrical and Electronics Engineers ( IEEE )
Notes: Authorized distributor of all IEEE proceedings
TOC:View Table of Contents
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