ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 2009. (ICEPT-HDP 2009) (2 VOLS)

ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 2009. (ICEPT-HDP 2009) (2 VOLS)

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006144
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Details

  • Title: 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009)
  • Date/Location: Held 10-13 August 2009, Beijing, China.
  • Editor: Bi, K.
  • IEEE #: CFP09553-POD
  • ISBN: 9781424446582
  • Pages: 1,273 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Oct 2009 )

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  • Title: 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009)
  • Date/Location: Held 10-13 August 2009, Beijing, China.
  • Editor: Bi, K.
  • IEEE #: CFP09553-POD
  • ISBN: 9781424446582
  • Pages: 1,273 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Oct 2009 )