Details
- Title: 2009 European Microelectronics and Packaging Conference (EMPC 2009)
- Date/Location: Held 16-18 June 2009, Rimini, Italy.
- IEEE #: CFP0954H-POD
- ISBN: 9781424447220
- Pages: 817 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2009 )
Description
Members/Attendees
Tab 4
- Title: 2009 European Microelectronics and Packaging Conference (EMPC 2009)
- Date/Location: Held 16-18 June 2009, Rimini, Italy.
- IEEE #: CFP0954H-POD
- ISBN: 9781424447220
- Pages: 817 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2009 )