THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 11TH 2010. (EuroSimE 2010)

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008058

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Title: 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE 2010)
Date/Location: Held 26-28 April 2010, Bordeaux, France.
IEEE #: CFP10566-POD
ISBN: 9781424470266
Pages: 712 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
POD Publisher: Curran Associates, Inc. ( Jun 2010 )

Title: 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE 2010)
Date/Location: Held 26-28 April 2010, Bordeaux, France.
IEEE #: CFP10566-POD
ISBN: 9781424470266
Pages: 712 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
POD Publisher: Curran Associates, Inc. ( Jun 2010 )