THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 11TH 2010. (EuroSimE 2010) (CD-ROM)

THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 11TH 2010. (EuroSimE 2010) (CD-ROM)

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008063
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  • Title: 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE 2010)
  • Date/Location: Held 26-28 April 2010, Bordeaux, France.
  • IEEE #: CFP10566-CDR
  • ISBN: 9781424470259
  • Format: CD-ROM
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jun 2010 )

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  • Title: 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE 2010)
  • Date/Location: Held 26-28 April 2010, Bordeaux, France.
  • IEEE #: CFP10566-CDR
  • ISBN: 9781424470259
  • Format: CD-ROM
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jun 2010 )