MICROSYSTEMS PACKAGING ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE. INTERNATIONAL. 5TH 2010. (IMPACT 2010) (2 VOLS)

MICROSYSTEMS PACKAGING ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE. INTERNATIONAL. 5TH 2010. (IMPACT 2010) (2 VOLS)

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010802
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Details

  • Title: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT 2010)
  • Date/Location: Held 20-22 October 2010, Taipei, Taiwan.
  • IEEE #: CFP1059B-POD
  • ISBN: 9781424497836
  • Pages: 1,154 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Apr 2011 )

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  • Title: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT 2010)
  • Date/Location: Held 20-22 October 2010, Taipei, Taiwan.
  • IEEE #: CFP1059B-POD
  • ISBN: 9781424497836
  • Pages: 1,154 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Apr 2011 )