MICROSYSTEMS PACKAGING ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE. INTERNATIONAL. 5TH 2010. (IMPACT 2010) (USB)

MICROSYSTEMS PACKAGING ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE. INTERNATIONAL. 5TH 2010. (IMPACT 2010) (USB)

Item #:
010821
$192.50 - $385.00
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Details

  • Title: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT 2010)
  • Date/Location: Held 20-22 October 2010, Taipei, Taiwan.
  • IEEE #: CFP1059B-USB
  • ISBN: 9781424497850
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Apr 2011 )

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  • Title: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT 2010)
  • Date/Location: Held 20-22 October 2010, Taipei, Taiwan.
  • IEEE #: CFP1059B-USB
  • ISBN: 9781424497850
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Apr 2011 )