THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL. 12TH 2011. (EUROSIME 2011)

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011453

$144.50 - $289.00

Details

Title: 2011 12th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011)
Date/Location: Held 18-20 April 2011, Linz, Austria.
IEEE #: CFP11566-POD
ISBN: 9781457701078
Pages: 645 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
POD Publisher: Curran Associates, Inc. ( Jun 2011 )

Title: 2011 12th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011)
Date/Location: Held 18-20 April 2011, Linz, Austria.
IEEE #: CFP11566-POD
ISBN: 9781457701078
Pages: 645 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
POD Publisher: Curran Associates, Inc. ( Jun 2011 )