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THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL. 12TH 2011. (EUROSIME 2011)

THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL. 12TH 2011. (EUROSIME 2011)

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THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL. 12TH 2011. (EUROSIME 2011)
Item #: 11453
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Product Description
Title:2011 12th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011)
Desc:Proceedings of a meeting held 18-20 April 2011, Linz, Austria.
Sponsor:Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:CFP11566-POD
ISBN:9781457701078
Pages:645 (1 Vol)
Format:Softcover
Publisher:Institute of Electrical and Electronics Engineers ( IEEE )
Notes: Authorized distributor of all IEEE proceedings
TOC:View Table of Contents
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