THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL. 12TH 2011. (EUROSIME 2011)

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Title:	2011 12th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011)
Desc:	Proceedings of a meeting held 18-20 April 2011, Linz, Austria.
Sponsor:	Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:	CFP11566-PRT
ISBN:	9781457701078
Pages:	645 (1 Vol)
Format:	Softcover
Publisher:	Institute of Electrical and Electronics Engineers ( IEEE )
Notes:	Authorized distributor of all IEEE proceedings
TOC:	View Table of Contents