Details
- Title: 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2011)
- Date/Location: Held 19-21 October 2011, Taipei, Taiwan.
- IEEE #: CFP1159B-POD
- ISBN: 9781457713873
- Pages: 499 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2012 )
Description
Members/Attendees
Tab 4
- Title: 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2011)
- Date/Location: Held 19-21 October 2011, Taipei, Taiwan.
- IEEE #: CFP1159B-POD
- ISBN: 9781457713873
- Pages: 499 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2012 )