THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL. 13TH 2012. (EUROSIME 2012) (CD-ROM)

THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL. 13TH 2012. (EUROSIME 2012) (CD-ROM)

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014830
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Details

  • Title: 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012)
  • Date/Location: Held 16-18 April 2012, Cascais, Portugal.
  • IEEE #: CFP12566-CDR
  • ISBN: 9781467315111
  • Format: CD-ROM
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( May 2012 )

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  • Title: 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012)
  • Date/Location: Held 16-18 April 2012, Cascais, Portugal.
  • IEEE #: CFP12566-CDR
  • ISBN: 9781467315111
  • Format: CD-ROM
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( May 2012 )