Details
- Title: 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2011)
- Date/Location: Held 12-14 December 2011, Hanzhou, China.
- IEEE #: CFP11EDP-POD
- ISBN: 9781467322881
- Pages: 376 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2012 )
Description
Members/Attendees
Tab 4
- Title: 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2011)
- Date/Location: Held 12-14 December 2011, Hanzhou, China.
- IEEE #: CFP11EDP-POD
- ISBN: 9781467322881
- Pages: 376 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2012 )