Details
- Title: 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2012)
- Date/Location: Held 22-23 May 2012, Tokyo, Japan.
- IEEE #: CFP1218S-POD
- ISBN: 9781467307437
- Pages: 262 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2012 )
Description
Members/Attendees
Tab 4
- Title: 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2012)
- Date/Location: Held 22-23 May 2012, Tokyo, Japan.
- IEEE #: CFP1218S-POD
- ISBN: 9781467307437
- Pages: 262 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2012 )