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DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS. SYMPOSIUM. 2012. (DTIP 2012)

DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS. SYMPOSIUM. 2012. (DTIP 2012)

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DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS. SYMPOSIUM. 2012. (DTIP 2012)
Item #: 15304
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Product Description
Title:2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2012)
Desc:Proceedings of a meeting held 25-27 April 2012, Cannes, France.
Sponsor:Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:CFP12DTI-POD
ISBN:9781467307857
Pages:259 (1 Vol)
Format:Softcover
Publisher:Institute of Electrical and Electronics Engineers ( IEEE )
Notes: Authorized distributor of all IEEE proceedings
TOC:View Table of Contents
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