Details
- Title: 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME 2012)
- Date/Location: Held 25-28 October 2012, Alba Iulia, Romania.
- IEEE #: CFP1207I-POD
- ISBN: 9781467347570
- Pages: 350 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2013 )
Description
Members/Attendees
Tab 4
- Title: 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME 2012)
- Date/Location: Held 25-28 October 2012, Alba Iulia, Romania.
- IEEE #: CFP1207I-POD
- ISBN: 9781467347570
- Pages: 350 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2013 )