MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE. INTERNATIONAL. 7TH 2012. (IMPACT 2012)

Item #:
017102
$123.50 - $247.00
Adding to cart… The item has been added

Details

  • Title: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2012)
  • Date/Location: Held 24-26 October 2012, Taipei, Taiwan.
  • IEEE #: CFP1259B-POD
  • ISBN: 9781467316354
  • Pages: 426 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Mar 2013 )

Description

 

Members/Attendees

 

Tab 4

 
  • Title: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2012)
  • Date/Location: Held 24-26 October 2012, Taipei, Taiwan.
  • IEEE #: CFP1259B-POD
  • ISBN: 9781467316354
  • Pages: 426 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Mar 2013 )