Details
- Title: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2012)
- Date/Location: Held 13-16 August 2012, Guilin, Guangxi, China.
- IEEE #: CFP12553-POD
- ISBN: 9781467316828
- Pages: 1,664 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2013 )
Description
Members/Attendees
Tab 4
- Title: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2012)
- Date/Location: Held 13-16 August 2012, Guilin, Guangxi, China.
- IEEE #: CFP12553-POD
- ISBN: 9781467316828
- Pages: 1,664 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2013 )