ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 13TH 2012. (ICEPT-HDP 2012) (USB)

ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 13TH 2012. (ICEPT-HDP 2012) (USB)

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017527
$241.00 - $482.00
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Details

  • Title: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2012)
  • Date/Location: Held 13-16 August 2012, Guilin, Guangxi, China.
  • IEEE #: CFP12553-USB
  • ISBN: 9781467316804
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Apr 2013 )

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  • Title: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2012)
  • Date/Location: Held 13-16 August 2012, Guilin, Guangxi, China.
  • IEEE #: CFP12553-USB
  • ISBN: 9781467316804
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Apr 2013 )