Details
- Title: 2012 14th International Conference on Electronic Materials and Packaging (EMAP 2012)
- Date/Location: Held 13-16 December 2012, Lantau Island, Hong Kong.
- IEEE #: CFP12506-POD
- ISBN: 9781467349451
- Pages: 471 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2013 )
Description
Members/Attendees
Tab 4
- Title: 2012 14th International Conference on Electronic Materials and Packaging (EMAP 2012)
- Date/Location: Held 13-16 December 2012, Lantau Island, Hong Kong.
- IEEE #: CFP12506-POD
- ISBN: 9781467349451
- Pages: 471 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2013 )