THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 14TH 2013. (EUROSIME 2013)

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018490

$146.50 - $293.00

Details

Title: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013)
Date/Location: Held 14-17 April 2013, Wroclaw, Poland.
IEEE #: CFP13566-POD
ISBN: 9781467361385
Pages: 669 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
POD Publisher: Curran Associates, Inc. ( Sep 2013 )

Title: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013)
Date/Location: Held 14-17 April 2013, Wroclaw, Poland.
IEEE #: CFP13566-POD
ISBN: 9781467361385
Pages: 669 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
POD Publisher: Curran Associates, Inc. ( Sep 2013 )