THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 14TH 2013. (EUROSIME 2013) (CD-ROM)

THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 14TH 2013. (EUROSIME 2013) (CD-ROM)

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018552
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  • Title: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013)
  • Date/Location: Held 14-17 April 2013, Wroclaw, Poland.
  • IEEE #: CFP13566-CDR
  • ISBN: 9781467361378
  • Format: CD-ROM
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Sep 2013 )

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  • Title: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013)
  • Date/Location: Held 14-17 April 2013, Wroclaw, Poland.
  • IEEE #: CFP13566-CDR
  • ISBN: 9781467361378
  • Format: CD-ROM
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Sep 2013 )