Details
- Title: 2013 IEEE COOL Chips XVI
- Date/Location: Held 17-19 April 2013, Yokohama, Japan.
- IEEE #: CFP13COL-POD
- ISBN: 9781467357807
- Pages: 38 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2013 )
Description
Members/Attendees
Tab 4
- Title: 2013 IEEE COOL Chips XVI
- Date/Location: Held 17-19 April 2013, Yokohama, Japan.
- IEEE #: CFP13COL-POD
- ISBN: 9781467357807
- Pages: 38 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2013 )