Details
- Title: 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2013)
- Date/Location: Held 16-18 April 2013, Barcelona, Spain.
- IEEE #: CFP13DTI-POD
- ISBN: 9781467344777
- Pages: 333 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2013 )
Description
Members/Attendees
Tab 4
- Title: 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2013)
- Date/Location: Held 16-18 April 2013, Barcelona, Spain.
- IEEE #: CFP13DTI-POD
- ISBN: 9781467344777
- Pages: 333 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2013 )