Details
- Title: 2013 1st International Workshop on Release Engineering (RELENG 2013)
- Date/Location: Held 20 May 2013, San Francisco, California, USA.
- IEEE #: CFP13ZAM-POD
- ISBN: 9781467364423
- Pages: 36 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2013 )
Description
Members/Attendees
Tab 4
- Title: 2013 1st International Workshop on Release Engineering (RELENG 2013)
- Date/Location: Held 20 May 2013, San Francisco, California, USA.
- IEEE #: CFP13ZAM-POD
- ISBN: 9781467364423
- Pages: 36 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2013 )