Details
- Title: 2013 IEEE International Symposium on Assembly and Manufacturing (ISAM 2013)
- Date/Location: Held 30 July - 2 August 2013, Xi'an, China.
- Editor: Wang, M.Y.
- IEEE #: CFP13ATP-POD
- ISBN: 9781479916559
- Pages: 372 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2013 )
Description
Members/Attendees
Tab 4
- Title: 2013 IEEE International Symposium on Assembly and Manufacturing (ISAM 2013)
- Date/Location: Held 30 July - 2 August 2013, Xi'an, China.
- Editor: Wang, M.Y.
- IEEE #: CFP13ATP-POD
- ISBN: 9781479916559
- Pages: 372 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2013 )