Details
- Title: 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2013)
- Date/Location: Held 3-5 September 2013, Glasgow, United Kingdom.
- IEEE #: CFP13SSD-POD
- ISBN: 9781467357357
- Pages: 463 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2014 )
Description
Members/Attendees
Tab 4
- Title: 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2013)
- Date/Location: Held 3-5 September 2013, Glasgow, United Kingdom.
- IEEE #: CFP13SSD-POD
- ISBN: 9781467357357
- Pages: 463 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2014 )