Details
- Title: 2013 IEEE International Symposium on Electromagnetic Compatibility (EMC 2013)
- Date/Location: Held 5-9 August 2013, Denver, Colorado, USA.
- IEEE #: CFP13EMC-POD
- ISBN: 9781479904112
- Pages: 874 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2013 )
Description
Members/Attendees
Tab 4
- Title: 2013 IEEE International Symposium on Electromagnetic Compatibility (EMC 2013)
- Date/Location: Held 5-9 August 2013, Denver, Colorado, USA.
- IEEE #: CFP13EMC-POD
- ISBN: 9781479904112
- Pages: 874 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2013 )