Details
- Title: 2013 International Conference on Biometrics and Kansei Engineering (ICBAKE 2013)
- Date/Location: Held 5-7 July 2013, Tokyo, Japan.
- IEEE #: CFP1316H-POD
- ISBN: 9781479906727
- Pages: 338 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2014 )
Description
Members/Attendees
Tab 4
- Title: 2013 International Conference on Biometrics and Kansei Engineering (ICBAKE 2013)
- Date/Location: Held 5-7 July 2013, Tokyo, Japan.
- IEEE #: CFP1316H-POD
- ISBN: 9781479906727
- Pages: 338 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2014 )