Details
- Title: 2013 IEEE CPMT Symposium Japan
- Subtitle: (Formerly VLSI Packaging Workshop of Japan)
- Date/Location: Held 11-13 November 2013, Kyoto, Japan.
- IEEE #: CFP13PWJ-POD
- ISBN: 9781479908769
- Pages: 225 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2014 )
Description
Members/Attendees
Tab 4
- Title: 2013 IEEE CPMT Symposium Japan
- Subtitle: (Formerly VLSI Packaging Workshop of Japan)
- Date/Location: Held 11-13 November 2013, Kyoto, Japan.
- IEEE #: CFP13PWJ-POD
- ISBN: 9781479908769
- Pages: 225 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2014 )