DESIGNCON. 2014. (3 VOLS)

DESIGNCON. 2014. (3 VOLS)

Item #:
022224
Our Price: $225.00
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Details

  • Title: DesignCon 2014
  • Subtitle: Where the Chip Meets the Board
  • Date/Location: Held 28-31 January 2014, Santa Clara, California, USA.
  • ISBN: 9781632665232
  • Pages: 2,130 (3 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: UBM Electronics
  • POD Publisher: Curran Associates, Inc. ( Jul 2014 )

Description

 

Members/Attendees

 

Tab 4

 
  • Title: DesignCon 2014
  • Subtitle: Where the Chip Meets the Board
  • Date/Location: Held 28-31 January 2014, Santa Clara, California, USA.
  • ISBN: 9781632665232
  • Pages: 2,130 (3 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: UBM Electronics
  • POD Publisher: Curran Associates, Inc. ( Jul 2014 )